Processing Capabilities
Leveling, slitting, brushing, film lamination, beveling & drilling, laser and waterjet cutting — one page per process, with parameters, tolerances and capacity all documented.
Leveling (Cut-to-Length)
Full coils leveled and cut to length with a length tolerance of ±1 mm; flat, wave-free surfaces ready for packing or the next process.
- Applicable Thickness0.3–6 mm
- Applicable Width300–1500 mm
- Cut-to-Length500–6000 mm
Slitting
Wide coils slit longitudinally into narrow strips with a minimum width of 8 mm and burr-free edges; paper corner protectors and wooden export crates available.
- Applicable Thickness0.3–3 mm
- Strip Width Range8–1500 mm
- Simultaneous Slits≤ 30 strips
Brushing / Polishing
No.4 straight grain and HL long-line finishes, oil or dry grinding available; uniform grain with no color variation or scratches.
- FinishNo.4 · HL
- Grit120–320
- Applicable Thickness0.3–3 mm
Film Lamination
Single- or double-sided PVC protective film; black-and-white film and laser film available; clean die-cut edges with no adhesive residue on removal.
- Film Thickness50–100 μm
- Film TypeBlack-and-white film · Laser film
- Max Width≤ 1500 mm
Beveling / Drilling
Beveling and drilling to drawing, with inspectable angles and hole spacing; ready for direct assembly with welded parts.
- Applicable Plate Thickness6–60 mm
- Bevel Angle30–45°
- Hole Diameterφ5–60 mm
Laser / Waterjet Cutting
Laser cutting ≤20 mm, waterjet ≤100 mm; circles, rings and profiled parts machined to drawing with minimal heat effect.
- Laser Thickness≤ 20 mm
- Waterjet Thickness≤ 100 mm
- Cutting Accuracy±0.1 mm